Advanced Infrared & Resistance Coil BGA and SMD Rework Systems
BGA Rework Systems from PDR are advanced, precision-engineered solutions for removing and replacing BGA, QFN, μBGA/CSP, Flip Chip, and other SMDs. Featuring infrared (IR) heating technology, models like the IR3100 and IR4100 eliminate the need for nozzles, allowing for a wide range of component rework with greater flexibility and reduced setup time. These systems use a high-powered IR top heater (500W) and a robust IR bottom preheater (up to 1900W on the IR4100), ensuring precise thermal control. Each unit comes standard with a Sodr-Cam Reflow Camera and non-contact IR pyrometer for real-time, closed-loop temperature monitoring. Intuitive Windows-based software enables multi-stage profiling, on-the-fly adjustments, unlimited profile storage, and flux-dipping. These features make PDR’s BGA Rework Systems ideal for complex rework applications in production, R&D, and repair environments.
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Advanced Infrared & Resistance Coil BGA and SMD Rework Systems
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